Tyvek® for Interleaf/Wafer Spacer for the semi-conductor industry, particles, scratching, ion contamination and static will cause damage in delicate electronic parts. Wafer packaging solution provider, integrated circuit (IC) design company, Our Hesion Inc. have been looking for improved packaging solutions to address these common issues.

Values that Tyvek® can provide:

Tear resistance to help secure the protection between wafers

Low linting and smooth surface can help avoid particles and scratching

Anti-static treatment can help minimize ESD (Electrostatic Discharge)

Tyvek® Styles:

Tyvek® 1025D, 1056D

FQA

Tyvek for Interleaf Wafer Spacer

Q1. What is your terms of payment?

T/T 30% deposit at order time and balance 70% pay by before shipment.

Q2. How about your delivery time?

Generally, it takes 20~30 working days to get goods ready. The final lead time depends on the items and quantity of your order.

Q3.Can you produce according to the samples?

Yes, we can produce according to your samples and technical drawings.

Q4.How do you make long-term business and relationship?

1. We keep good quality and competitive price to ensure our customers benefit.

2. We respect every customer as close partner and friends wherever they came from. We try best to satisfy our customers based on mutual benefit.

东莞市恒升防静电用品有限公司

Tyvek For Interleaf Wafer Spacer