HESION unique compounding technology gives the spacer the performance of ESD protection, low particles, and low ion contamination. Embossing prevents adhesion to the wafer. Both sides can be used.

Pick-up with a vacuum pad is also possible.

Features

>>>Static antistatic performance
>>>Low particle level
>>>Low ion contamination
>>>Both sides of spacer have the same surface pattern

Specification

Model number：: HSW-□-350（07H）（□：diameter）

Material：: Conductive PE

Surface resistance value：: R < 1.0×10⁹Ω

Emboss Thickness：: 350μｍ

东莞市恒升防静电用品有限公司

Interleaf: Conductive Type/HSW(07H)